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1) Advanced MBE Structures & Device Fabrication Technologies:
- High Performance in Gain, Out-put Power, Linearity, Efficiency,
Noise Figure,
- Phase Noise & Low or No Gain Expansion
- High Reliability
- Good Uniformity & Yield
2) Systematic & Advanced Device Layout
- Unit Cell & High Performance
- Easy Device Modeling & Scaling
3) Device Serialization and Automatic 100% D.C. Test
- Idss Binning & Good Trace-ability
- Ready for Automatic Sorting For High Volume Production
4)
Good Production Process Control
- Documented All Process & Test Procedures
with SPC for Good Repeatability
- Reliability Screening with P-6 Power Blast
& High Temperature Storage on Every Wafer
- High Yield, Uniformity & Reliability
5) Creative Company
- Same Mask Set for Different MBE Material & Device Processing
- Well-developed Simple Wafer Fabrication Process with Simple Equipment
Set-up to Achieve High Performance Devices with High Yield, Uniformity &
Repeatability as well as Low Equipment Down-Time & Low Cost
6) Dynamic Company
- Extensive Product offering in Discrete FETs, Internally Matched Power FETs, Pre-matched Power FETs and MMICs in Chips & Packages
- Continued & Quick Future Product Development to Meet Customer's Requirements
7) Responsive Company
- Quick Delivery with Low Cost & High Volume
from Stock
- Good Customer Interaction & Support
- Willingness to Work with Customers for
Future Product Development
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